Document Details

Document Type : Article In Journal 
Document Title :
Sequential in situ STM imaging of electrodissolving copper single-crystal domains in aqueous perchloric acid: Kinetics and mechanism of the interface evolution
Sequential in situ STM imaging of electrodissolving copper single-crystal domains in aqueous perchloric acid: Kinetics and mechanism of the interface evolution
 
Subject : Chemistry 
Document Language : English 
Abstract : The evolution of Cu crystal surfaces in an aqueous perchloric acid solution at both null (j=0) and constant anodic apparent current density (j=6 μA cm-2) at room temperature was followed by in situ scanning tunneling microscopy sequential imaging. For j=0, the Cu surface turns out to be highly dynamic as terrace growth step displacement, and smoothening of small pits can be observed. These processes lead to a small decrease in the value of the root-mean-square roughness (ξ). On the other hand, for j=6 μA cm-2, an inhomogeneous attack proceeds with a marked increase in ξ. In this case, while some surface domains become progressively rough others develop nm-sized etched pits that turn the interface unstable. The evolution of the Cu topography under the experimental conditions of this work was simulated using a Monte Carlo algorithm based on a dissolution model in which surface processes are influenced by inhomogeneity stabilizing cavities. 
ISSN : 1098-0121 
Journal Name : Physical Review B - Condensed Matter and Materials Physics 
Volume : 56 
Issue Number : 7 
Publishing Year : 1418 AH
1997 AD 
Article Type : Article 
Added Date : Monday, December 26, 2011 

Researchers

Researcher Name (Arabic)Researcher Name (English)Researcher TypeDr GradeEmail
سعدالله قاري عزيزAziz, Saadullah GResearcherDoctorate 
Maria Elena VelaVela, Maria ElenaResearcherDoctorate 
G A AndreasenAndreasen, G AResearcherDoctorate 
R C SalvarezzaSalvarezza, R CResearcherDoctorate 
Alberto Hernández CreusHernández Creus, Alberto ResearcherDoctorate 
Alejandro J ArvíaArvía, Alejandro JResearcherDoctorate 

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